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6808/6802 MICROPROCESSORS

 

The 6808 was widely used in Bally and Williams systems thru the 1990¡¯s. It is no longer readily available and we will cover a substitute that can be used in these systems.

          If you find this diagram in the games schematics, your problem is solved:

 

 

       This diagram indicates the choice of either the 6808 or the 6802 by means of a simple pair of jumpers. Jumper ¡®A¡¯ goes to logic 5volts and ¡®B¡¯ goes to ground. When a 6808 is used, pin 36 goes to ground. When a 6802 is used the same pin goes to logic 5 volts to power the ¡®on board¡¯ Ram feature . This is the real difference between the two Processors. With this Ram enabled, the 6810 Ram IC can be eliminated. The first question is why two IC¡¯s if one could have been used? The answer has to be cost and availability (in the 1980¡¯s). The 6808 has almost disappeared while the 6802 is still around at $5.00 to $9.00. We will cover the most common boards found in Bally and Williams games before the introduction of the WPC system. The chart will show the availability of jumpers or other options that can be used.

 

     MODEL         CIRCUIT BOARD           OPTIONS 

                               AS-2518-51            JUMPERS       6808= ¡®B¡¯

       BALLY                SOUND BOARD          ABOVE  U3      6802= ¡®A¡¯

          NOTE:  WHEN JUMPERED FOR 6802, IC U10 (6810 RAM) CAN BE REMOVED.

                                                                          

       BALLY                SQUAWK & TALK      JUMPERS        6808= ¡®L¡¯

                                                                             ABOVE U2       6802= ¡®K¡¯

           NOTE:  WHEN JUMPERED FOR 6802, IC 6 (6810 RAM) CAN BE REMOVED. 

 

       BALLY        XENON SOUND/SPEECH  JUMPERS        6808= ¡®B¡¯

                                                                             ABOVE U2       6802= ¡®A¡¯

           NOTE:  WHEN JUMPERED FOR 6802, IC 10 (6810 RAM) CAN BE REMOVED.

 

          WILLIAMS - EARLY SOUND BD. (LEVELS 3,4,6)- USES ONLY 6802

 

       WILLIAMS-SOUND/SPEECH BD. (LEVELS 6,7)   6808/6802 (NO JUMPERS)

                                                                      

       WILLIAMS          JUMPERS             REMOVE JUMPER UNDER CRYSTAL

           LEVEL 6             BELOW               (BELOW CAPACITOR). THEN INSTALL

              CPU               CRYSTAL             4.7K RESISTOR BELOW OLD JUMPER

NOTE: WHEN JUMPERED FOR 6802,  IC 13 (6810 RAM) CAN BE REMOVED. IC16 REMAINS.

 

       WILLIAMS          LEVEL 7 CPU    6808/6802 (NO JUMPERS)                  

 

       WILLIAMS                    LEVEL 9 CPU    (USES 2 PROCESSORS)                  

  THE CPU PROCESSOR AT U17 CAN BE EITHER 6808/ 6802,  WITH NO JUMPERS NEEDED. THE MATCHING U18 (CMOSRAM) IS A BATTERY BACKED  6116 AND STAYS IN CIRCUIT.THE SOUND  PROCESSOR  AT U11 HAS JUMPERS AT W1 AND W2  (LOCATED ABOVE J16).     THESE JUMPERS WILL ALLOW FOR THE 6808   WITH THE U12 (6810 RAM),  OR THE  6802  WITH OR WITHOUT THE U12 (6810 RAM). 

 

 

        WILLIAMS LEVEL 11 - 11C (USES 2 PROCESSORS)

            THIS SERIES OF CPU¡¯S WILL ACCEPT EITHER 6808/ 6802 AT U15, (THE CPU SECTION) OR U24 (THE SOUND SECTION),  WITH  NO JUMPERS INVOLVED.

            OF COURSE, THERE IS ONE SMALL EXCEPTION.  WILLIAMS DOES MAKE A JUMPER DESIGNATION FOR THE LEVEL 11 SERIES USING EITHER 6808/ 6802.  IT CONCERNS THE JUMPERS W16 (FOR U15) AND  W17 (FOR U24). THESE JUMPERS ARE USED WHEN THE 6808/ 6802 IS MADE BY MOTOROLA.

 

ADDITIONAL IC INFORMATION:

 

THE NUMBERS AND LETTERS FOUND STAMPED ON EACH PROCESSOR IS A DESCRIPTION OF THE SPECIFICATIONS OF THE IC.  THE FOLLOWING CHART WILL HELP EXPLAIN.

 

                       SUFFIX LETTER -  P= PLASTIC,  S= CERDIP, L= CERAMIC

 

                        1.0 MHz                                   1.5 MHz                                        2 MHz

 

                        6800                                       68A00                                                68B00

                        6802                                       68A02                                                68B02

                        6808                                       68A08                                                68B08

                       

            IT MAKES LITTLE SENSE TO PUT A 2 Mhz PROCESSOR IN CPU THAT ONLY CALLS FOR A 1.0 Mhz. AND THE OPPOSITE IS ALSO TRUE. THE NEWER WPC SYSTEM USES 68B09 AND RUNS AT TWICE THE SPEED OF OLDER SYSTEMS. YOU CANNOT SPEED UP THE OLDER CPU¡¯S BY SIMPLY INSTALLING A FASTER PROCESSOR.

            THIS LETTERING SYSTEM IS ALSO USED ON THE 6821 PIA¡¯S AND THE SPEED SHOULD BE MATCHED UP TO THE PROCESSOR.

            NOTE ALSO THAT THE SOUND BOARDS FROM THE 11 SERIES CPU¡¯S ARE RUNNING A 2 MHz 68B09 PROCESSOR WITH MATCHING 68B21 PIA¡¯S.

            ARMED WITH ALL THIS INFORMATION, IT SHOULD BE AN EASY CHOICE TO MAKE WHEN YOU CAN¡¯T LOCATE A REPLACEMENT 6808-  PUT IN A 6802!! 

 

INSTALLING A 6802 INTO A BALLY -17 OR -35 MPU 

 

               

THIS ¡®PLUG-IN¡¯ ADAPTER WILL ALLOW A 6802 TO REPLACE THE 6800 IN ANY BALLY MPU. IT WILL ALSO ALLOW FOR THE REMOVAL OF THE 6810  (U7). SIMPLY REMOVE THE OLD 6800 PROCESSOR AND PLUG IN THE ADAPTER. THE IC 15 (BALLY PART# MC3459L) IS REMOVED AND A MACHINED PIN SOCKET IS INSTALLED. A 74LS37 IC IS PLUGGED IN THE IC15 SOCKET AND PIN 6 IS ALREADY JUMPERED OVER TO THE ADAPTER (TO SUPPLY THE 01 CLOCK SIGNAL). THE 6802 PROCESSOR IS CRYSTAL DRIVEN SO ALL THE PARTS OF THE OLD (9602) CLOCK CIRCUIT FOR THE BALLY 6800  ARE NO LONGER NEEDED AND CAN REMAIN IN PLACE. THE ADAPTER WITH A 6802 ON BOARD IS READY TO RUN AND ALL ADDITIONAL PARTS ARE SUPPLIED. ALL THAT IS REQUIRED IS THE  INSTALLATION THE 14 PIN SOCKET (74LS37) AND PLUGGING IN THE ADAPTER. FINALLY, REMOVE THE IC7 6810- (RAM  IS NOW ON BOARD 6802). 

COMPLETE ASSEMBLY AS SHOWN IS $37.00 INCLUDING SHIPPING ANYWHERE IN USA

 

 

HOW TO INSTALL A MACHINE PIN SOCKET

 

            REMOVING AN IC (TO INSTALL A SOCKET) IS USUALLY NOT A BIG DEAL. DOING THAT PROCEDURE ON A 30 YEAR OLD BALLY MPU IS A BIG DEAL. BALLY PRODUCED A PCB IN 1978 THAT WAS ABOUT THE MOST COST EFFECTIVE POSSIBLE. IT HAD COPPER PADS ON THE TOP LAYER AND COPPER PADS ON BOTTOM LAYER BUT NO CONNECTING ¡°PLATE THRU¡± DESIGN. WHEN DE-SOLDERING  A BALLY BOARD EXTREME CARE HAS TO BE USED TO PREVENT PADS FROM WORKING LOOSE. SOME PADS ARE CONNECTED TO TRACES WHICH PROVIDED SOME STABILITY, BUT MANY PADS ARE SIMPLY ADHERED TO THE SURFACE. THE BEST METHOD FOR REMOVAL HAS PROVEN TO BE THE SIMPLEST AND CHEAPEST.

 

 

 

WHEN THE BOARD BEING WORKED ON HAS THE TRADITIONAL ¡®PLATE THRU¡¯ DESIGN  A HAKKO 808 IS RECOMMENDED.

 

 

 HAKKO 808 COSTS FROM $150.00- $200.00 DEPENDING ON VENDOR. USE GOOGLE TO GET THE BEST PRICE.

 

 

            THE HAKKO 808 IS A FINE TOOL BUT IT TENDS TO PULL UP PADS ON A 30 YEAR OLD BALLY MPU, ESPECIALLY IF THERE HAS BEEN ANY BEAD BLAST CLEANING OF ACID DAMAGE. ONLY SAFE METHOD IS SOLDER WICK REMOVAL. BELOW IS A TYPICAL IC 15 REMOVAL AND SOCKET INSTALLATION. SOLDER WAS REMOVED BY SEVERAL PASSES USING SOLDER WICK AND 60 WATT IRON. IF THE SOLDER DOESN¡¯T WANT TO MOVE, PRIME THE AREA WITH SOME NEW SOLDER. THIS NEW MIX WILL HELP BREAK LOOSE THE OLD SOLDER.

 

 

            SOLDER WAS REMOVED FROM ALL 14 PINS ON BOTH TOP AND BOTTOM OF BOARD. BENT PINS WERE LIFTED UP OFF SURFACE AND PLACED IN CENTER OF HOLE. IT MAY TAKE SEVERAL PASSES TO GET ALL THE PINS ¡®FLOATING¡¯ IN THE HOLES BUT IT DOESN¡¯T TAKE MUCH RESIDUAL CONTACT FOR A PIN TO PULL A PAD UP WHEN CHIP IS PRIED OFF.  AFTER BEING SURE THAT ALL SOLDER IS GONE, APPLY A LITTLE PRESSURE UNDER THE IC TO JUDGE AMOUNT OF TENSION LEFT BETWEEN IC AND PADS.

 

 

ANY STUCK PINS SHOULD BE SOLDER WICKED AGAIN BEFORE IC WILL ¡®SNAP¡¯ LOOSE.

            SOLDERING IN A MACHINED PIN SOCKET IS DIFFERENT THAN WHEN USING THE ¡®STANDARD¡¯ TYPE OF SOCKET. IT IS NECESSARY TO PLACE THE SHOULDERS OF A MACHINED PIN SOCKET SLIGHTLY ABOVE THE TOP SURFACE OF THE BOARD. DO THIS BY TACKING 2 PINS ON OPPOSITE SIDES OF THE SOCKET TO OBTAIN A RAISED/ ALIGNED POSITION.

 

 SURFACE IS SANDED TO PREPARE COPPER TO ACCEPT SOLDER

            ONLY THE CENTER PINS ON BOTH RAILS ARE TACK SOLDERED AND SOCKET IS STRAIGHTENED. THE SPACE BETWEEN THE SHOULDERS AND THE PADS IS INCREASED ALLOWING FOR A WEDGE OF SOLDER FILLER. IF SOCKET WERE FLUSH TO SURFACE, THE SOLDER TIP IS UNABLE TO REACH UNDER THE SOCKET (IN TIGHT LOCATIONS) WITHOUT MELTING THE PLASTIC FRAME.

 

AFTER TACKING SOCKET INTO POSITION (ON TOP SURFACE), TURN BOARD OVER AND SOLDER ALL 14 PINS/ PADS.

            NOW FINISH OF THE 14 PINS/ PADS ON TOP OF SOCKET. PLACE SOLDER TIP NEXT TO SHOULDER AND APPLY A SMALL BIT OF SOLDER. THE END RESULT WILL BE A PERFECT WEDGE OF SOLDER AND A TROUBLE FREE CONNECTION.

 

THE FINAL RESULTS SHOULD RESEMBLE THIS PHOTO. TOO MUCH SOLDER WILL TEND TO RUN OVER TO BARE TRACES.

 

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